Orbit Merret

PCB assembling

Basic parameters of the line

- mounting PCBs up to maximum size 450 x 450 mm
- range of housings available for mounting - from 01005 (0.5x0.25mm) to 55x55 mm (respect.75 mm)
- mounting accuracy for chip components ± 30 νm
- in-line SMT line with conveyors and unloader
- lead-free soldering
- washing final DPS
- option of complete production inclusive of mounting standard parts and assembly

Application of paste and adhesive

Automatic silkscreen printer MOTOPRINT-AVS
- high accuracy and repeatability of the printing process, reliability
- automatický systém optického středění
- programmable rate and amount of weight on the spatula, vertical separation of DPS from the stencil with controlled speed, which prevents smearing
  the paste even in very fine motives
- maximum frame size 600 x 600 mm, print format 360 x 400 mm

Manual silkscreen printer UNIPRINT - adjustable amount of weight on the guided spatula
- self-braking on the guided spatula
- precise separation of DPS and the stencil after the print with the aid of the back twin tenons
- maximum frame size 510 x 510 mm, print format 400 x 410 mm

Mounting

Automatic Pick & Place system ESSEMTEC CLM 9000
- non-contacting laser centring of the parts
- range of housings available for mounting - 0402 to QFP components with span up to 0,3mm
- dispenser for application of paste/adhesive
- maximum format DPS - 300 x 400 mm
- practical mounting rates up to 3000 components/hour

Automatic Pick & Place system SAMSUNG SM 321
- camera controlled centring of the parts
- range of housings available for printing - from 01005 (0.5 x 0.25mm) to 55 x 55 mm (respect. 75 mm)
- 6 setting heads, each with independent camera
- maximum format DPS - 450 x 450 mm
- practical mounting rates up to 21 000 components/hour

Soldering

Reflow oven HELLER 1700 MKIII
- 14 heating zones + 1 cooling zone
- adjustable temperature to 350°C
- central support for large-size DPS
- software for measurement and evaluation of thermal profiles

Steam soldering in SLC 300
- soldering in inert atmosphere, ensures high-quality soldering even in complex printed circuits
- high accuracy of the soldering temperature (better than ± 1 °C)
- temperature of lead-free soldering 230 °C
- maximum format DPS 340 x 300 mm

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